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CSP Substrate is short for "Chip Scale Packaging," a substrate with multiple advantages of packaging technologies that are superior in size and operation, and is a reliable sealing device.
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Features
- Our company's CSP contribute special traits such as ultra thin and also include miniaturization, better electrical properties, and relatively simple implementation processes and reduces the overall creation cost.
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Applications and Final Products
- Used in products that put an importance on size and weight, and useful in portable equipment such as cellular phones, laptops, small calculators, and digital cameras.
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Main Specifications
Layers Hole Diameter L/S Core Thickness Total Thickness 2 Layers, 4 Layers 100μm 30/30 60μm 130μm~110μm -
Product Inquiries
- Domestic Sales Division
- Tel : 0266-71-1562
- Fax : 0266-73-3366