The BOC (Board on Chip) package is designed as a cost reduction version of CSP for high frequency memory devices.
- The layout of the central pad, through the use of low cost wire bonding and BGA technology, minimizes the wire length and gives the structure excellent electrical properties.
Applications and Final Products
- The BOC package is an ideal IC package for devices that is said to be the next generation of memory products such as SDRAM、SGRAM、DDR SDRAM、RAMBUS and DRAM.
L/S Core Material Thickness Slit Finishing Degree of Precision Between Slit Pattern 50/50 150μm Precision Punching ±50μm
- Domestic Sales Division
- Tel : 0266-71-1562
- Fax : 0266-73-3366