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The BOC (Board on Chip) package is designed as a cost reduction version of CSP for high frequency memory devices.
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Features
- The layout of the central pad, through the use of low cost wire bonding and BGA technology, minimizes the wire length and gives the structure excellent electrical properties.
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Applications and Final Products
- The BOC package is an ideal IC package for devices that is said to be the next generation of memory products such as SDRAM、SGRAM、DDR SDRAM、RAMBUS and DRAM.
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Main Specifications
L/S Core Material Thickness Slit Finishing Degree of Precision Between Slit Pattern 50/50 150μm Precision Punching ±50μm -
Product Inquiries
- Domestic Sales Division
- Tel : 0266-71-1562
- Fax : 0266-73-3366