CSP Substrate is short for "Chip Scale Packaging," a substrate with multiple advantages of packaging technologies that are superior in size and operation, and is a reliable sealing device.
- Our company's CSP contribute special traits such as ultra thin and also include miniaturization, better electrical properties, and relatively simple implementation processes and reduces the overall creation cost.
Applications and Final Products
- Used in products that put an importance on size and weight, and useful in portable equipment such as cellular phones, laptops, small calculators, and digital cameras.
Layers Hole Diameter L/S Core Thickness Total Thickness 2 Layers, 4 Layers 100μm 30/30 60μm 130μm～110μm
- Domestic Sales Division
- Tel : 0266-71-1562
- Fax : 0266-73-3366