Module substrates are multi-layer structured for packages that require multiple dies, and for discrete components and for passive components installed in conventional mother board packages.
- Continuing various technological measures for structure demands including developing edge resistance coating techniques as a measure against formations of foreign objects and structure formations corresponding to switchovers from conventional ceramic structures for cost reduction purposes.
Applications and Final Products
- Used in wireless devices such as radio frequencies, power amps, GPS modules, camera modules, and cellular phones. Module substrate technology is used to strengthen single parts packages that require excellent wiring performance and miniaturization.
Layers Through-hole Copper Plating BVH Total Thickness Build-up 4 Layers 40μm VIA-Filling Copper Plating 0.38mm
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- Tel : 0266-71-1562
- Fax : 0266-73-3366