Semiconductor packages are progressing more and more to be miniaturized, thinner and increasingly advanced. Supporting this is our ultra-thin board finish and ultra-fine wiring finish facilities for IC package substrates.
- Laser Finishing Machine
- Ultra-High Speed Rotating NC Ball Version
- Automatic Plating Device for VIA-Filling
- Fine Wire Finishing Devices Including LDI
- Roll Coater for SR
- AOI
- AFVI
- Multilayer Lamination Finishing Devices
- Measuring Devices Including Three Dimensional Measuring Equipments
- Analyzers Including Electron Microscopes