P-BGA is a multi-pin LSI that provides maximum requirement of smallness, slimness and lightness to a package, and a resin substrate that replaces the pin transmitting electrical signal to the printed circuit board from the chip with solder balls mounted to the package bottom surface. It is suitable for use in logic system semiconductors required in high speed calculations such as PC laptops mainly.
- We are providing a high accuracy interposer with an excellent electrical performance induced from low heat resistance and inductance reduction that prevent wiring densification and heating using our ultra fine, small hole finishing technology.
Applications and Final Products
- Featuring high density, low inductance and low thermal conductivity, it is suitable for products that require high speed calculations and is used in products such as computers and digital home electronics.
Layers Hole Diameter L/S Core Thickness Total Thickness 2 Layers, 4 Layers 100μm 30/30 60μｍ 130μm～110μm
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